UK
PERFETSELL 27 PCS BGA Reballing Net Stencils Universal Rework Net Stencils Templates High Precision Steel Template Mesh Directly Heat Set Kit Soldering Tool for Soldering Accessories
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£9.99
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Last refresh Feb/18/2021 05:27 PM
Last refresh Feb/18/2021 05:27 PM
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Universal Steel Template:There are 27 rework net stencils of different specifications, which are sufficient for use. Contains 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.76mm, 1mm, etc.
Various Sizes: Each piece of BGA rework net stencils has specifications under the surface, which is convenient for you to choose. Contains 24*24mm, 27*27mm, 30*30mm, 33*33mm, 34*34mm, 41*41mm and other sizes. (Length * width)
304 Stainless Steel Material:These mesh directly heat set kit are made of high-quality 304 stainless steel, strong and durable, not easy to rust, and the thickness of the steel mesh is appropriate. It can be heated by a hot air machine, and it is not easy to deform when heated.
Easy to Use:The area of the steel template matches the area of the BGA chip, which can reduce the waste of solder balls, and can easily ball the BGA IC. This is a useful and economical accessory for BGA soldering.
Wide Application:BGA reballing stencils are specially designed for notebook computers, desktop computers, communication motherboard north-south bridge, graphics card and other BGA chips. For the chip that the alignment of solder ball is uneven, or with a different spacing chips
Various Sizes: Each piece of BGA rework net stencils has specifications under the surface, which is convenient for you to choose. Contains 24*24mm, 27*27mm, 30*30mm, 33*33mm, 34*34mm, 41*41mm and other sizes. (Length * width)
304 Stainless Steel Material:These mesh directly heat set kit are made of high-quality 304 stainless steel, strong and durable, not easy to rust, and the thickness of the steel mesh is appropriate. It can be heated by a hot air machine, and it is not easy to deform when heated.
Easy to Use:The area of the steel template matches the area of the BGA chip, which can reduce the waste of solder balls, and can easily ball the BGA IC. This is a useful and economical accessory for BGA soldering.
Wide Application:BGA reballing stencils are specially designed for notebook computers, desktop computers, communication motherboard north-south bridge, graphics card and other BGA chips. For the chip that the alignment of solder ball is uneven, or with a different spacing chips
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